FILE PHOTO: FILE PHOTO: Semicon China in Shanghai
- Código: 26387242
- Data do Conteúdo: 29/06/2023
- Inclusão no Site: 17/04/2024 12:22:18
- Assunto: ASML-RESULTS/CHINA
- Legenda: FILE PHOTO: The logo of chip equipment maker ASML is seen at its booth during Semicon China, a trade fair for the semiconductor industry, in Shanghai, China June 29, 2023. REUTERS/Nicoco Chan/File Photo ORG XMIT: FW1
- Serviço/Categoria: Reuters / Reuters Internacional
- Crédito: Reuters/Folhapress
- Dimensão: 43cm x 29cm
- Tamanho: 17.26 megapixels
- Resolução: 300 dpi
- Palavras-chave: N/A